Impedance Controlled Standard Build-Ups

Impedance-controlled buildups are carefully structured PCB layer arrangements designed to maintain precise electrical impedance, ensuring signal integrity across high-frequency circuits. This control is crucial in modern PCB design, helping to prevent signal loss and interference, particularly in complex, multi-layer configurations.

At PCB Power, we are committed to providing industry-standard impedance-controlled build-ups for PCB fabrication. With our extensive experience in PCB manufacturing, we deliver reliable, precision-engineered stack-up configurations that meet rigorous signal integrity requirements. We recognize the critical role of consistent impedance in high-performance PCB designs, and you can count on us to uphold the highest standards of quality and reliability.

Below, you’ll find detailed specifications for our 4, 6, and 8-layer impedance-controlled build-ups. Each configuration includes precise information on layer materials, thicknesses, trace widths (TW), and trace-to-trace spacing (TT) designed to achieve specific impedance values (such as 50Ω, 90Ω, and 100Ω). These parameters are crucial in maintaining signal integrity and performance in high-frequency PCB applications.

Please Note:
- These impedance values are calculated based on high-Tg FR4 material with a dielectric constant (DK) of 4.3.

We hope this information provides valuable insights into designing PCB stack-ups that meet your project's unique requirements.

If you have any questions or need further assistance with your PCB stack-up design, please don't hesitate to reach out to our experienced support team. We’re here to help you achieve the best possible PCB configuration for your application.